Osprey CE 11(50Si/50Al)

Typical applications include electronic packages and components for inertial systems.

  • Offers improved CTE matching (11.0 ppm/°C at room temperature) to electronic circuit boards compared to aluminium or copper.
  • In many cases, reliable carrier for most ceramic substrates and device materials, including alumina and GaAs.
  • One third the weight of copper.
  • Weldable and plateable.
  • Lower cost material and easy to machine with lower machining costs vs. CE7 or CE9.
Technical Specifications
Composition Silicon
CTE ppm/C 11.0
Thermal Conductivity (25°C) W/m.K 140
Density g/cm3 2.5
Bend Strength (three point) MPa 172
Young's Modulus GPa 109