Typical applications include electronic packages and components for inertial systems.
- Offers improved CTE matching (11.0 ppm/°C at room temperature) to electronic circuit boards compared to aluminium or copper.
- In many cases, reliable carrier for most ceramic substrates and device materials, including alumina and GaAs.
- One third the weight of copper.
- Weldable and plateable.
- Lower cost material and easy to machine with lower machining costs vs. CE7 or CE9.
|Thermal Conductivity (25°C)||W/m.K||140|
|Bend Strength (three point)||MPa||172|